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Micro Cutting Pad (MCP)

Koch Chemie / Application Equipment

Micro Cut Pad (MCP)

Swirl Remover Sponge

High-quality special sponge for removing scratches, holograms and polishing marks using the Micro Cut M3.02. The short height of 23 mm ensures low torsion, very good handling and a high level of stability. The special density of the foam material allows long-term compression hardness during polishing. The optimised open-cell structure and the number of cells contribute to the high level of abrasiveness and excellent hygiene factors.

The milling edge provides extra flexibility for the pads, allowing them to fit more easily into the edges of the applied surface.

Compression hardness: 10. Abrasiveness: 5.

Packaging

Product no.Package

999583                  1 piece                                       Ø 76 x 23 mm

999584                    1 piece                                          Ø 126 x 23 mm

999585                  1 piece                                      Ø 150 x 23 mm

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